Typical Themes

•       CMOS platform technologies & opportunities

•       Logic device performance and circuit design challenges

•       Advanced, novel process integration schemes and (applications-driven) scaling approaches

•       Innovations and advances in process control and metrology.

•       Design technology co-optimization (DTCO), System technology co-optimization (STCO)

New or Trending Areas

•       GAA (Gate-All-Around) nanosheet-based devices and circuits; novel channel materials.

•       Sequential, monolithic 3D integration, heterogenous chiplets, 2.5/3D integration, thermal management

•       Logic for memory

•       Interconnects (BEOL, Backside power delivery)

•       BEOL compatible transistors

Typical themes:

• 2D and devices on low-dimensional materials

• Novel channel materials and devices

• Non-CMOS emerging devices

• Devices for neuromorphic and approximate computing

• Spintronic and magnetic devices

• Steep-slope devices

• Quantum computing devices

New or trending areas:

• Topological materials and devices, and phase transitions transistors

• Emerging state machines, time dynamical systems, approximate computing

• Novel cryogenic devices

Typical Themes

•       Conventional memories

•       Emerging memories

•       3D memory technologies

•       Memories (such as HBM) for AI or near memory computing applications

•       In-Package Memory for PPA augmentation

New or Trending Areas

•       Memories to break the memory wall

•       Memory-enabled artificial intelligence applications

•       Memory-Logic 3D stacking

•       System-technology co-optimization

•       Memory Pooling and communication

•       New memory hierarchy

Typical Themes

•       Technology CAD and benchmarking

•       Advanced logic and memory device modeling

•       Atomistic material, process, and interconnect simulation

•       Compact models for DTCO

•       Alternative computing device modeling

•       Nanoscale (bio)sensors modeling

New or Trending Areas

•       Multi-scale simulation with hybrid techniques

•       Advanced packaging and 3D integration modeling

•       Thermal modeling

•       Low-temperature and quantum device modeling

•       Device modeling for photonics

•       Device modeling for in-memory and in-sensor computing

Typical Themes

• Analog or digital AI accelerators based on in-memory computing with advanced memory tecnlogies, including SRAM, DRAM, Flash, ReRAM, MRAM, PCRAM, ferroelectric memory, and memory selector

• Memory, logic, and nanoelectronic devices with novel functions and/or materials for new and unconventional compute paradigms

• Probabilistic and approximate computing enabled by stochastic behaviors of devices and materials

• Emerging computing algorithms enabled by memory, logic, and nanoelectronic devices

New or Trending Areas

• Device-algorithm co-optimization

• Monolithic 3D integration for neuromorphic computing

• Transformer-based networks accelerated by in-memory computing

• Neuromorphic sensors and in-sensor computing

Typical Themes

• Heterogeneous optoelectronic integration including sources, modulators, or detectors

• Neuromorphic photonics

• Single photon emitters and detectors

• Luminescent devices based on new materials including perovskites and quantum dots

• Displays and imagers for augmented or virtual reality

• Holographic devices and displays

• Displays with unconventional form or size

• Photodetectors and imagers with new materials or flexible platform and printed electronics

• Imagers with ultra-miniaturized pixels, spectral bandwidth beyond visible, high sensitivity, or high time-resolution,

• Image sensors with pixels for range sensing, TOF, RGBZ, LIDAR

New or Trending Areas

• Photonic devices for quantum computation and sensing

• Intelligent Image Sensors, Advanced On-chip optics for imagers

• In-display and under-display Sensors

Typical Themes

•       Power and/or high speed (microwave to THz devices) devices, modules, and systems

•       Manufacturing processes, device design, modeling, physics, and reliability of power and/or high-speed devices

•       Fundamental studies on doping, traps, interface states, and device reliability for power and/or high-speed switching devices

•       Micro and mm-wave devices, such as power amplifiers, low noise amplifiers, switches and mixers.

•       Energy harvesting devices and circuits

New or Trending Areas

•       Wide bandgap and ultra-wide bandgap semiconductors such as SiC, (Al)GaN, diamond, β-Ga₂O₃, BN

•       Emerging ferroelectric materials and devices: Al(Sc)N, Al(Y)N, …

•       Power devices for applications from automotive and aviation to smart grid

•       Device and circuits for 5G and 6G

•       Extreme environment power and high-speed devices

Typical Themes

•       Component-level FEOL/MEOL/BEOL characterization and reliability modeling

•       Robustness and security of electronic circuits and systems

•       Reliability of conventional and emerging memories

•       Circuits, systems-level reliability, and aging

•       Thermal and PID/charging management in existing and novel process integration

•       Reliability of RF/mm-wave/5G in high-frequency applications

•       Reliability of devices, circuits, and systems for more-than-Moore applications, automotive, aerospace and bio-applications (BioFETs, DNA detection, etc.)

•       Reliability of cryogenic devices for future quantum computing applications

New or Trending Areas

•       Reliability of new materials and/or new architectures for transistors

•       Reliability of advanced 2.5D/3D IC advanced package

•       Design for testing (DFT) / Design for reliability (DFR) solutions for improved reliability

Typical Themes

•       Physical and biochemical integrated sensors

•       Energy harvesting and storage devices

•       Flexible devices for wearable applications

•       Tunable passives, SAW/BAW/MEMS RF devices, filters, antenna arrays

•       MEMS for Internet of Things

•       Bio-electronic interfaces and implantable devices

New or Trending Areas

•       Intelligent sensors with embedded AI

•       Multimodal biochemical and physical sensors for healthcare

•       Sensors and devices for human-machine interface

•       In-sensor computing and in-MEMS computing

•       Large kₜ² piezoelectric materials and devices

•       Hybrid organic/inorganic microfabrication, devices, and interfaces